mThe Federal Risk and Authorization Management Program has started soliciting feedback from stakeholders on a plan to create a new funding source to support efforts to scale FedRAMP, grow the program’s authorization
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NASA’s Space Technology Mission Directorate and the U.S. Patent and Trademark Office have partnered to promote innovation through technology transfer and commercialization opportunities. STMD and USPTO Partnership USPTO said on Dec. 19 the
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The Defense Advanced Research Projects Agency has conducted a test to evaluate the performance of its new unmanned surface vessel, or USV. The agency said Thursday DARPA’s No Manning Required Ship, or NOMARS,
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Samsung Electronics, Amkor Technology and Texas Instruments have secured new funding to increase semiconductor production in the United States. The grants are part of the CHIPS Incentives Program’s funding opportunity for commercial
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David McKeown, a former Wash100 Award winner, has been appointed special assistant for cybersecurity innovation at the Chief Information Office of the Department of Defense, effective Dec. 16. The DOD CIO announced on LinkedIn
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President Joe Biden has signed H.R. 10545, or the “American Relief Act, 2025,” into law on Dec. 21, averting a government shutdown. Bipartisan Funding Bill The White House said Saturday the funding bill
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IBM’s Troy Edgar has been nominated as the next deputy secretary of homeland security by President-elect Donald Trump. If confirmed, Edgar will leverage his homeland enterprise experience to support the U.S. Department of Homeland
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The Department of the Navy has released a new strategy outlining guiding principles and providing a comprehensive framework for developing and transitioning advanced manufacturing technologies. The U.S. Navy said Thursday the inaugural
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The Office of Management and Budget has issued new guidance to help strengthen domestic supply chains for U.S.-produced semiconductors through federal procurement. OMB said Thursday the memorandum outlines additional management actions to
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The Department of Commerce has awarded SK Hynix $458 million in direct funding for the company’s project to build an advanced memory packaging plant in West Lafayette, Indiana. The funding will support
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